Your trade fair construction partner for the trade fair:

Bondexpo

in

Stuttgart

07.-09.10.2025

Bondexpo in Stuttgart is the international trade fair for adhesive technology and joining technology. It presents practice-oriented solutions and innovations in industrial bonding, casting, sealing and foaming. Manufacturers, system providers and users from a wide range of industries — from automotive engineering to electronics to medical technology — find a specialized platform for products, machines, materials and process solutions here. The focus is on efficiency, automation and sustainable connectivity technologies.

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