Bondexpo 2028: international trade fair for industrial adhesive bonding technology, 24–26 October 2028 at Messe Stuttgart in Stuttgart. Since 2026, Bondexpo has taken place every two years, alongside Motek. EXFAIR plans and builds the exhibition stand: system stand, custom build, full service.
Bondexpo 2028: international trade fair for industrial adhesive bonding technology, 24–26 October 2028 at Messe Stuttgart in Stuttgart. The focus is on adhesives and sealants, dispensing and application technology, and testing and measuring equipment. EXFAIR plans and builds exhibition stands at Bondexpo Stuttgart: from compact system stands to fully custom builds, with full service from planning to dismantling – on time and on budget.



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